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| Model | SUMMIT3100 | SUMMIT3100HC-R |
| Test Site Quantity | 6/12/16 (Base on Different Model) | 6 |
| Temperature type | Dual temp | Tri-Temp |
| Contact Force | Max.120kgf /site | Max.180kgf /site |
| Rotator Function | ±90°，180° | ±90°，180° |
| Test Board Dimension | 6 site: Max 568 mm x 500 mm, 12 site: Max 290 mm x 500 mm, 16 site:Max 206 mm x 500 mm | 6 site: Max 568 mm x 500 mm |
| Package Type | QFN,QFP,BGA,LGA,PLCC,PGA, CSP,TSOP etc. | QFN,QFP,BGA,LGA,PLCC,PGA, CSP,TSOP etc. |
| Tray Type | JEDEC | JEDEC |
| Temperature Range | +25℃ to +130℃ ±3℃ | -55℃ to +155℃ ±3℃ |
| Num Of Sorting | Auto Tray ×4 | Auto Tray ×4 |
| Tester Interface | RS232，Network | RS232，Network |
| Heating Rate (Option: +ATC) | Ambient~125℃ < 5min | Ambient~125℃ <15min |
| Cooling Rate (Option: +ATC) | 125~Ambient< 15min | Ambient~-55℃ < 30min |
| Heat Dissipation (Option: +ATC) | 200W@25℃，400W@70℃，450W@125℃ (Contact size: 40 mm x 40 mm) |
150W@-55℃，400W@25℃，400W@125℃ (Contact size: 65 mm x 65 mm) |
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